An aromatic substituted urea, used as latent accelerator in Dicyandiamide /epoxy resin curing systems
Min . 171℃
Particle size 98.0%
Max. 10 μm
U 210 Monuron accelerator similar as UR200 ,well combined with DICY by reducing the time and required temperature of epoxy curing:
★ structural adhesives e.g. conductive resin
★ Powder coatings
★ Prepregs of epoxy composites
★ Encapsulation compounds for electronic industry
★ Reinforcements e.g. carbon fiber
U 210 Monuron with a similar function with UR200 brings a moderate curing speed . the outstanding achievement is showing a longer latency -shelf life can be up to min. 5 months for finished systems than other UR accelerators.
U 210 Monuron is suggested to be added at the percent < 5 phr Curing can be finalized within 70 minutes at 100°C and less than 20 minutes at 140°C.
U 210 Monuron
Hydrophobic fumed silica
Liquid bisphenol-A-epoxy resin (EEW 182 -192)
DSC –Onset [°C]
DSC –Tg [°C]
Gel time 140°C [min]
Shelf life (double viscosity) at 23°C [weeks]
Result values may be varied based on different used resin matrix.
Fillers and other additives to formulation can also change properties.
Packing and storage
--10 or 15kg per Box，carton，kraft bags, FIBC or customized
--Keep sealed in original package ,under a cool and dry condition ,avoid humidity. recommended storage period no exceeds 18 months.
For further information about U 210 Monuron,please leave a message and we will get you prompt response