A substituted urea used as latent accelerator for Dicyandiamide curing in epoxy resin,
Min . 126℃
Particle size 98.0%
Max. 10 μm
UR300 as an accelerator performs similar and more reactivity than UR200 in dicyandiamide -epoxy curing systems
★ Prepregs of epoxy composites e.g. sports equipments industry
★ Encapsulation compounds for electronic industry e.g. CCL ,
★ structural adhesives e.g. conductive resin
★ Reinforcements e.g. carbon fiber
★ Powder coatings
Similar function while more safer use than UR200&UR600
Suitable for chlorine-free formulation
The addition of UR300 to dicyandiamide -epoxy formulations is particularly for the curing temperature range of 110-140℃. By providing active isocyanate & dimethyl- amine(DMA), UR300 can catalye curing of epoxy. With less steric hindrance, UR300 realizes the faster cure process than UR200. the higher reactivity of UR300 brings excellent mechanical and electrical properties to cured resins.
Good latency allows the shelf life up to 2 months under room condition.
Liquid bisphenol-A-epoxy resin (EEW 182 -192)
DSC –Onset [°C]
DSC –Tg [°C]
Gel time 140°C [min]
Shelf life (double viscosity) at 23°C [days]
Result values may be varied based on different used resin matrix.
Fillers and other additives to formulation can also change properties.
Packing and storage
--10 or 15kg per Box, carton, kraft bags, FIBC or customized
--Keep sealed in original package, under a cool and dry condition, avoid humidity. Recommended storage period no exceeds 18 months.
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